ResearchWho?

변동진

교수

고려대학교(서울) 공과대학 신소재공학부

논문[28]

#28. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

2021.5 · Materials

(DOI) https://doi.org/10.3390/ma14092367

#27. Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

2021.1 · Metals

(DOI) https://doi.org/10.3390/met11020210

프로시딩[2]

#2. Effect of plasma pretreatment of soda-lime glass on the preferred orientation of TiO/sub 2/ prepared by PECVD

2003.12

(DOI) https://doi.org/10.1109/plasma.2003.1228847

#1. Characteristics of Cu thin film on PET by ECR-PECVD

2003.12

(DOI) https://doi.org/10.1109/plasma.2003.1229952