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인하대학교 공과대학 화학공학과

논문[4]

#4. Effect of the addition of O2 on copper etching using high density plasma of acetylacetonate/Ar

2022.12 · Materials Science in Semiconductor Processing

(DOI) https://doi.org/10.1016/j.mssp.2022.107004

#3. Etch Characteristics of Copper Thin Films in Inductively Coupled Plasma of Piperidine/Ethanol/Ar Gas Mixture

2021.05 · ECS Journal of Solid State Science and Technology

(DOI) https://doi.org/10.1149/2162-8777/abffb4

발표[23]

#23. Effect of Non-Corrosive Gas Mixture on Etching of Cu Thin Film Using Inductively Coupled Plasma Reactive Ion Etching

2018 ICMAP

#22. Dry Etching of Copper Thin Films in High Density Plasma of Organic Acids

2018 ICMAP

특허[29]

#29. 호이슬러합금의식각방법{The method of etching of Heusler alloy materials}

[등록] 10-1588607-0000

대한민국

#28. 스퍼터링증착을이용한Zn(O, S)박막의제조방법

[등록] 10-1662993

대한민국