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논문[36]
#36. A 32-dB SNR Readout IC With 20-Vpp Tx Using On-Chip DM-TISM in HV BCD Process for Mutual-Capacitive Fingerprint Sensor
2020.7 · IEEE Transactions on Circuits and Systems II: Express Briefs
(DOI) https://doi.org/10.1109/TCSII.2019.2937541
#35. Experimental realization of Zenneck type wave-based non-radiative, non-coupled wireless power transmission
2020.1 · Scientific reports
(DOI) https://doi.org/10.1038/s41598-020-57554-1
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발표[2]
#2. Evanescent Mode Resonance in Metasurface Antenna On Metal Surface
2019 International Vacuum Electronics Conference (IVEC)
2019.4
#1. Improved SNR, On-Chip Differentially Modulated TISM Signaling in HV DMOS Process for Mutual Capacitance Fingerprint Sensor
2018 IEEE International Symposium on Circuits and Systems (ISCAS)
2018.5
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DONGNYEONG KANG
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Young Taek Han
단국대학교
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Sangwo Nam
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Yejin Kim
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jungyun lee
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